HCL-Foxconn JV OSAT
HCL-Foxconn JV | Assembly & Packaging
TipWhy This Matters
A joint venture between HCL Group and Foxconn (Taiwan) — India’s largest contract manufacturer entering semiconductors.
What does this facility make?
Semiconductor assembly and test operations. The facility will handle chip packaging for multiple end markets.
Why does it matter?
Foxconn is the world’s largest electronics manufacturer (it assembles iPhones) and its entry into India’s semiconductor ecosystem signals serious industrial intent. Located near the upcoming Noida International Airport at Jewar, this facility is positioned to serve as an export hub.
Key Facts
| Company | HCL-Foxconn JV |
| Partners | None |
| Type | Assembly & Packaging |
| Capability | OSAT (36M units/year) |
| Status | Under Construction |
| Investment | ₹3,700 crore |
| Location | Jewar, Uttar Pradesh |
| Category | Commercial (ISM Approved) |
Technical Complexity
1/5
Benchmarked against a 3nm fab (5/5).
Timeliness
On track
Project Timeline
- 01 May 2025 — Approved under ISM
- 01 Jun 2025 — Construction begins at Jewar, near Noida International Airport
Sources
- PIB: SEMICON India 2025 factsheet (01 Sep 2025)
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