CG Semi OSAT Facility
CG Power & Industrial Solutions | Assembly & Packaging
Launched India’s first end-to-end OSAT pilot line. Partnership with Japan’s Renesas brings automotive-grade chip packaging to India.
What does this facility make?
Assembles, tests, and packages semiconductor chips for consumer electronics and industrial applications. Partners with Renesas (Japan) for automotive chips and Stars Microelectronics (Thailand) for packaging technology.
Why does it matter?
CG Semi’s pilot line at Sanand was a proof-of-concept moment — it showed that Indian companies can run semiconductor back-end operations at commercial quality. The Renesas partnership is particularly significant because automotive chips have stringent quality requirements. India producing automotive-grade packages is a stepping stone to becoming a serious player in the global auto supply chain.
Key Facts
| Company | CG Power & Industrial Solutions |
| Partners | Renesas Electronics, Stars Microelectronics |
| Type | Assembly & Packaging |
| Capability | Consumer & Industrial OSAT (15M chips/day) |
| Status | Under Construction |
| Investment | ₹7,600 crore |
| Location | Sanand, Gujarat |
| Category | Commercial (ISM Approved) |
Technical Complexity
1/5
Benchmarked against a 3nm fab (5/5).
Timeliness
On track
Project Timeline
- 29 Feb 2024 — Union Cabinet approves CG Semi OSAT under ISM
- 01 Jun 2024 — Construction begins at Sanand
- 28 Aug 2025 — India’s first OSAT pilot line inaugurated — G1 facility goes live
Sources
- PIB: Cabinet approves semiconductor units (01 Mar 2024)
- PIB: Inauguration of India’s first OSAT Pilot Line at CG Semi, Sanand (28 Aug 2025)
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