3D Glass Solutions Packaging
3D Glass Solutions Inc. | Assembly & Packaging
Brings next-generation glass packaging technology to India — a frontier area even globally.
What does this facility make?
Produces advanced packaging using 3D glass substrates instead of traditional silicon or organic materials. Glass offers better signal integrity, thermal performance, and miniaturisation for high-frequency applications (5G, RF, sensors). Capacity: 70,000 glass panels/year, 50 million assembled units/year, and 13,000 advanced 3D heterogeneous integration modules.
Why does it matter?
Glass-based packaging is a next-generation technology that even leading semiconductor companies are still developing. By hosting this facility, India gets an early foothold in a packaging technology that could become industry-standard in the coming decade.
Key Facts
| Company | 3D Glass Solutions Inc. |
| Partners | Intel Corporation (technology partner for proposed $3.3bn follow-on facility, MoU stage — not yet ISM-approved) |
| Type | Assembly & Packaging |
| Capability | Next-gen Glass Substrates (50M units/year) |
| Status | Under Construction |
| Investment | ₹1,943 crore |
| Location | Bhubaneswar, Odisha |
| Category | Commercial (ISM Approved) |
Technical Complexity
1.6/5
Benchmarked against a 3nm fab (5/5).
Timeliness
On track
Project Timeline
- 01 Aug 2025 — Approved by Union Cabinet under ISM
- 19 Apr 2026 — Foundation stone laid at Info Valley, Khordha district, Bhubaneswar — India’s first advanced 3D chip packaging unit breaks ground in presence of CM Mohan Charan Majhi and Union Minister Ashwini Vaishnaw
- 29 May 2026 — Intel, 3DGS, and the Government of Odisha sign an MoU for a proposed, separate $3.3 billion (~₹27,500 crore) advanced substrate facility at the same Bhubaneswar-Khurda site — a much larger follow-on proposal, with Intel as technology partner (process expertise, technology licensing, quality systems, workforce development), not yet Cabinet-approved under ISM. Distinct from the ₹1,943 crore ISM-approved project above, which is already under construction.
Sources
- PIB: SEMICON India 2025 factsheet (01 Sep 2025)
- PIB: Cabinet approves new semiconductor projects (01 Aug 2025)
- PIB: Groundbreaking of India’s First Advanced 3D Semiconductor Packaging Unit in Odisha (19 Apr 2026)
- Intel and 3DGS announce plans for $3.3 billion semiconductor substrate manufacturing facility (29 May 2026)
- Intel to set up $3.3Bn substrate manufacturing plant in India, partners with 3DGS (29 May 2026)
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