3D Glass Solutions Packaging
3D Glass Solutions Inc. | Assembly & Packaging
Brings next-generation glass packaging technology to India — a frontier area even globally.
What does this facility make?
Produces advanced packaging using 3D glass substrates instead of traditional silicon or organic materials. Glass offers better signal integrity, thermal performance, and miniaturisation for high-frequency applications (5G, RF, sensors).
Why does it matter?
Glass-based packaging is a next-generation technology that even leading semiconductor companies are still developing. By hosting this facility, India gets an early foothold in a packaging technology that could become industry-standard in the coming decade.
Key Facts
| Company | 3D Glass Solutions Inc. |
| Partners | None |
| Type | Assembly & Packaging |
| Capability | Next-gen Glass Substrates (50M units/year) |
| Status | Approved |
| Investment | ₹1,943 crore |
| Location | Bhubaneswar, Odisha |
| Category | Commercial (ISM Approved) |
Technical Complexity
1.7/5
Benchmarked against a 3nm fab (5/5).
Timeliness
On track
Project Timeline
- 01 Aug 2025 — Approved by Union Cabinet under ISM
Sources
- PIB: SEMICON India 2025 factsheet (01 Sep 2025)
- PIB: Cabinet approves new semiconductor projects (01 Aug 2025)
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