Tata Electronics Semiconductor Fab
Tata Electronics (TEPL) | Fab
India’s first commercial semiconductor fabrication plant. The most ambitious and complex project in the ISM portfolio.
What does this facility make?
Will fabricate silicon wafers at 28nm-55nm process nodes — the chips inside cars, IoT devices, industrial equipment, and telecom infrastructure. These are mature-node chips that India currently imports in massive quantities.
Why does it matter?
This is the project that will determine whether India can actually make chips, not just package them. A fab is orders of magnitude more complex than an assembly plant. Tata’s partnership with Taiwan’s PSMC brings process technology know-how, but building and operating a fab requires mastering thousands of manufacturing steps. If Dholera succeeds, it fundamentally changes India’s position in the global semiconductor supply chain.
Key Facts
| Company | Tata Electronics (TEPL) |
| Partners | Powerchip Semiconductor Manufacturing Corp (PSMC), Taiwan, Kelington Group Berhad, Malaysia (fab infrastructure/process systems), FUJIFILM Corporation, Japan (semiconductor materials supply), Sumitomo Chemical Co., Ltd., Japan (semiconductor materials supply), Nexperia, Netherlands (MOSFET production partnership) |
| Type | Fab |
| Capability | 28nm-55nm Logic (50,000 Wafers/Month) |
| Status | Under Construction |
| Investment | ₹91,000 crore |
| Location | Dholera, Gujarat |
| Category | Commercial (ISM Approved) |
Technical Complexity
2.9/5
Benchmarked against a 3nm fab (5/5).
Timeliness
Delay (TBD)
Original target: Dec 2026 (source)
Project Timeline
- 29 Feb 2024 — Union Cabinet approves Tata-PSMC fab under the Modified Semiconductor Fab Scheme
- 13 Mar 2024 — PM Modi lays foundation stone at Dholera Special Investment Region
- 13 Mar 2024 — Construction begins — site preparation and civil works
- 16 May 2026 — Tata Electronics and ASML sign MoU for lithography equipment supply, talent development, and supply chain collaboration for the Dholera fab
- 17 Sep 2026 — Tata Electronics and FUJIFILM sign MoU; FUJIFILM to invest ~₹800 crore in a semiconductor-materials plant in Dholera SIR to supply high-purity chemicals (e.g. photoresists) for the fab, and to work with Indian chemical manufacturers to localise raw-material production
- 17 Sep 2026 — Tata Electronics and Nexperia announce strategic partnership; Nexperia to lay groundwork for producing its MOSFET portfolio at Tata’s Dholera fab (front-end), alongside assembly/test of Nexperia discretes at Tata’s Jagiroad, Assam OSAT (back-end) — a framework for long-term cooperation, not a standalone Nexperia India facility or investment
- 18 Sep 2026 — Tata Electronics and Kelington Group (Malaysia) sign MoU; Kelington to supply ultra-high-purity process piping and critical fab infrastructure/gas-delivery systems to accelerate the fab’s operational readiness
- 18 Sep 2026 — Tata Electronics and Sumitomo Chemical sign MoU to explore supplying the Dholera fab with photoresists, functional chemicals, and high-purity chemicals (hydrogen peroxide, isopropyl alcohol, ammonia water, sulfuric acid), and to explore Sumitomo manufacturing semiconductor materials locally in India — no India facility or investment committed yet
OECD Taxonomy Classification
Classification using the OECD’s proposed semiconductor production taxonomy from Chips, Nodes and Wafers: A Taxonomy for Semiconductor Data Collection (OECD STI Policy Paper, August 2024, Figure 7, p. 27). The taxonomy organises front-end wafer fab data into three dimensions: plant information, capability, and capacity.
| Dimension | Field | Value |
|---|---|---|
| Plant Information | Location | Dholera, Gujarat, India |
| Owner | Tata Electronics Private Limited (India); technology partner: Powerchip Semiconductor Manufacturing Corp (PSMC), Taiwan | |
| Status | Under Construction | |
| Start year | 2026 (expected first wafers; construction began March 2024) | |
| Business model | Foundry | |
| Capability | Chip type | Logic |
| Detailed chip type | Info not available (foundry; depends on customer orders — likely MCU, microcontroller, power management, SoC) | |
| Feature size | 28nm – 55nm | |
| Wafer size | Info not available | |
| Transistor type | Planar MOSFET with High-K/Metal Gate (HKMG); 28nm is a pre-FinFET node | |
| Process technologies | DUV (Deep Ultraviolet) lithography; High-K dielectrics; Metal gate | |
| Semiconductor material | Silicon (Si) | |
| Capacity | Wafer starts per month | ~50,000 wspm (target) |
| Cleanroom size | Info not available |
Supply Chain
Equipment, gas, and materials suppliers with their own tracked India facility feeding this project:
- Linde India — Dholera Air Separation Unit — Bulk industrial gases (oxygen, nitrogen, argon) via on-site air separation, piped directly to Tata’s Dholera fab.
- INOX Air Products — Dholera Electronic Specialty Gas Hub — UHP bulk and specialty gases — nitrogen, oxygen, argon, hydrogen — for fabs and OSAT units.
- ASML India — GIFT City Customer Support Office — Customer support and service operations for ASML’s lithography systems supplied to Indian fabs, primarily Tata’s Dholera fab.
Sources
- PIB: PM lays foundation stone for semiconductor facilities (13 Mar 2024)
- PIB: SEMICON India 2025 factsheet (01 Sep 2025)
- Fujifilm and Tata Electronics Announce Strategic Partnership to Accelerate Semiconductor Materials Ecosystem in India (17 Sep 2026)
- Tata Electronics and Kelington Collaborate to Accelerate Operational Readiness of Dholera Fab (18 Sep 2026)
- Tata Electronics and Sumitomo Chemical Sign MoU for High-Quality Semiconductor Materials (18 Sep 2026)
- Nexperia and Tata Electronics Announce Strategic Partnership Across Semiconductor Manufacturing, Technology and Innovation (17 Sep 2026)
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