Suchi Semicon OSAT Facility
Suchi Semicon Private Limited | Assembly & Packaging
Brings a domestic Indian player into scaled discrete-semiconductor packaging with explicit ISM backing. It also broadens India’s back-end ecosystem beyond multinational-led projects.
What does this facility make?
Packages and tests discrete semiconductor devices used in power electronics, consumer electronics, lighting, industrial systems, and automotive applications. The company site also highlights capabilities across small-outline, power, and QFN package families.
Why does it matter?
Discrete devices are not glamorous, but they are everywhere in power conversion and electronics manufacturing. A viable domestic OSAT base in this segment matters for supply-chain depth, and Suchi’s tie-up with ROHM suggests a route to better process discipline and customer access.
Key Facts
| Company | Suchi Semicon Private Limited |
| Partners | ROHM Co., Ltd., Japan |
| Type | Assembly & Packaging |
| Capability | Discrete Semiconductor OSAT (1,033.2M chips/year) |
| Status | Approved |
| Investment | ₹868 crore |
| Location | Surat, Gujarat |
| Category | Commercial (ISM Approved) |
Technical Complexity
1/5
Benchmarked against a 3nm fab (5/5).
Timeliness
On track
Project Timeline
- 25 Feb 2025 — Suchi Semicon publicly announces plans for a Surat OSAT facility
- 01 Mar 2026 — Suchi Semicon and ROHM enter a partnership for outsourced semiconductor assembly and test
- 05 May 2026 — Union Cabinet approves Suchi Semicon’s discrete semiconductor OSAT unit under ISM
Sources
- PIB: Cabinet approves two more semiconductor manufacturing units (05 May 2026)
- Semiconductor projects worth ₹4,000 crore get Cabinet go-ahead (05 May 2026)
- Suchi Semicon announces Rs 870 crore semiconductor plant in Surat (25 Feb 2025)
- ROHM and Suchi Semicon press release (01 Mar 2026)
- Suchi Semicon: What We Offer (06 May 2026)
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