Micron ATMP Facility
Micron Technology | Assembly & Packaging
India’s first operational semiconductor facility. Proved that a global chipmaker would bet on India.
What does this facility make?
Packages DRAM and NAND flash memory chips — the memory inside your phone, laptop, and data centre servers. Raw silicon wafers arrive from Micron’s fabs abroad and are assembled, tested, and packaged here.
Why does it matter?
Memory packaging is the least complex part of chipmaking, but Micron choosing India over other Asian countries was a watershed moment. It signalled to the global industry that India is a credible semiconductor destination. The facility also anchors a cluster of semiconductor units in Sanand, Gujarat.
Key Facts
| Company | Micron Technology |
| Partners | None |
| Type | Assembly & Packaging |
| Capability | Advanced Memory Packaging (DRAM & NAND) |
| Status | Operational |
| Investment | ₹22,516 crore |
| Location | Sanand, Gujarat |
| Category | Commercial (ISM Approved) |
Technical Complexity
1.3/5
Benchmarked against a 3nm fab (5/5).
Timeliness
7.9m delay
Project Timeline
- 22 Jun 2023 — Announced during PM Modi’s US state visit; Micron CEO Sanjay Mehrotra commits Rs.22,516 crore
- 22 Jun 2023 — Approved by the Union Cabinet under ISM
- 01 Sep 2024 — Construction begins at Sanand GIDC
- 23 Sep 2025 — Facility inaugurated — India’s first semiconductor assembly and test unit goes live
- 26 Feb 2026 — Volume production begins — chips rolling off the line at commercial scale
Sources
- PIB: Micron begins volume production at India facility (26 Feb 2026)
- Micron Celebrates Opening of India’s First Semiconductor Assembly and Test Facility (23 Sep 2025)
- PIB: Micron to invest in semiconductor ATMP facility in India (22 Jun 2023)
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