ASIP Advanced Packaging
Advanced System In Package Technologies Pvt Ltd (ASIPTPL) | Assembly & Packaging
Andhra Pradesh’s first ISM-approved semiconductor project. Brings System-in-Package (SiP) technology to South India — key for miniaturised IoT and wearable devices.
What does this facility make?
System-in-Package (SiP) assemblies — multiple chips integrated into a single package. Used in smartwatches, wireless earbuds, IoT sensors, and other devices where space is at a premium. Two-phase project: Phase 1 (₹542 cr), Phase 2 (₹1,846 cr).
Why does it matter?
SiP is where the semiconductor industry is heading — integrating multiple functions (processor, memory, sensors, connectivity) into one tiny package. Having SiP capability in India positions the country for the next wave of electronics miniaturisation.
Key Facts
| Company | Advanced System In Package Technologies Pvt Ltd (ASIPTPL) |
| Partners | None |
| Type | Assembly & Packaging |
| Capability | System-in-Package (96M units/year) |
| Status | Under Construction |
| Investment | ₹2,388 crore |
| Location | Visakhapatnam, Andhra Pradesh |
| Category | Commercial (ISM Approved) |
Technical Complexity
1/5
Benchmarked against a 3nm fab (5/5).
Timeliness
On track
Project Timeline
- 01 Aug 2025 — Approved by Union Cabinet under ISM (central fiscal support: ₹468 crore)
- 08 Jun 2026 — Groundbreaking ceremony at Tarluvada village, Anandapuram mandal, Visakhapatnam — Andhra Pradesh’s first ISM project breaks ground
Sources
- PIB: SEMICON India 2025 factsheet (01 Sep 2025)
- IIT Tirupati: ASIP plant to come up in Visakhapatnam (04 Apr 2026)
- Vizag set to host A.P.’s first India Semiconductor Mission project (The Hindu) (04 Jun 2026)
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