ASIP Advanced Packaging
Advanced System in Package Tech | Assembly & Packaging
Brings System-in-Package (SiP) technology to South India — key for miniaturised IoT and wearable devices.
What does this facility make?
System-in-Package (SiP) assemblies — multiple chips integrated into a single package. Used in smartwatches, wireless earbuds, IoT sensors, and other devices where space is at a premium.
Why does it matter?
SiP is where the semiconductor industry is heading — integrating multiple functions (processor, memory, sensors, connectivity) into one tiny package. Having SiP capability in India positions the country for the next wave of electronics miniaturisation.
Key Facts
| Company | Advanced System in Package Tech |
| Partners | None |
| Type | Assembly & Packaging |
| Capability | System-in-Package (96M units/year) |
| Status | Approved |
| Investment | ₹468 crore |
| Location | Tirupati, Andhra Pradesh |
| Category | Commercial (ISM Approved) |
Technical Complexity
1.7/5
Benchmarked against a 3nm fab (5/5).
Timeliness
On track
Project Timeline
- 01 Aug 2025 — Approved by Union Cabinet under ISM
Sources
- PIB: SEMICON India 2025 factsheet (01 Sep 2025)
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