ASIP Advanced Packaging

Advanced System In Package Technologies Pvt Ltd (ASIPTPL) | Assembly & Packaging

Published

August 24, 2026

TipWhy This Matters

Andhra Pradesh’s first ISM-approved semiconductor project. 30-acre facility at Tarluvada, built with South Korea’s APACT Co. as technology partner.

What does this facility make?

Wire-bond, flip-chip, and ball grid array (BGA) packaging initially. Plans to introduce 2.5D and 3D advanced packaging within two to three years. Targets AI, high-performance computing, data centre, and communications chips. Two-phase project: Phase 1 (~₹460 cr initial investment), Phase 2 (expansion to ₹2,500 cr total).

Why does it matter?

Brings advanced packaging capability to South India with a roadmap to 2.5D/3D — the packaging technologies needed for AI and HPC chips. Academic partnerships with IIT Tirupati and IIT Hyderabad, plus an in-house training centre, aim to build a local semiconductor workforce pipeline.

Key Facts

Company Advanced System In Package Technologies Pvt Ltd (ASIPTPL)
Partners APACT Co. (South Korea)
Type Assembly & Packaging
Capability Advanced Packaging (96M chips/year)
Status Under Construction
Investment ₹2,500 crore
Location Visakhapatnam, Andhra Pradesh
Category Commercial (ISM Approved)

Technical Complexity

1/5

Benchmarked against a 3nm fab (5/5).

Timeliness

On track

Project Timeline

  • 01 Aug 2025 — Approved by Union Cabinet under ISM (central fiscal support: ₹468 crore)
  • 08 Jun 2026 — Groundbreaking ceremony at Tarluvada village, Anandapuram mandal, Visakhapatnam
  • 01 Aug 2026 — PM Modi lays foundation stone and unveils plaque; CM Chandrababu Naidu joins virtually

Sources

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